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Written by Administrator
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Tuesday, 28 February 2006 19:00 |
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FEATURES
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Cover Story Cleaning Up after Pb-Free Lacking field data for no-clean Pb-free solders and confidence in accelerated aging tests? An expected increase in contaminants means effective cleaning is the only way to guarantee an assembly won't fail due to residues. Leigh Jansen
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Process Management Concurrent Manufacturing in an EMS Environment The changes and precautions to take down the line during implementation of Pb-free manufacturing. This review covers printing, placement, soldering, inspection, materials management, compatibility and marking. Amey Teredesai and Tony Batalha
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Soldering Materials Pb-Free Solder Assembly for Mixed-Technology Boards While assemblers push for a single alloy throughout all soldering processes to avoid cross-contamination, tests show no joint degradation related to the mixing of SN100C and SAC alloys. Karl Seelig
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Wire Bonding Increasing Process Reliability in Fine-Pitch Wire Bonding A two-year study involving millions of bonds on LQFPs and BGAs identifies close ties between the performance of the wire bonder capillary and subsequent failures. Yair Alcobi
FIRST PERSON
MONEY MATTERS
TECH TALK
DEPARTMENTS
Industry News Market Watch Assembly Insider Nepcon China and SMT/Hybrid/Packaging Product Preview Ad Index Classifieds
On the cover: Due to a lack of Pb-free aging data, cleaning may make a comeback. (Cover photo courtesy Humiseal/Chase Specialty Coatings.)
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Last Updated on Tuesday, 07 February 2012 09:45 |