FEATURES

• Packaging Roadmap
  R&D Needs for Packaging
  Two areas of research that have evolved quickly during the last two years are SiP and 3-D packaging. The iNEMI Roadmap highlights the approaches and clarifies industry needs.
  Joe Adam

• SEAs 2007
  The Learning Organization
  Key Electronics’ never-ending pursuit of improvements has boosted it to consecutive Service Excellence Awards.
  Chelsey Drysdale

• Cover Story
  A Study of 0201s and Tombstoning in Pb-Free Systems
  Tombstoning is reported to occur more frequently in Pb-free systems, and smaller components are at greater risk than larger ones. A comprehensive DoE finds paste and placement offsets to be the top contributor to defects.
  Paul Neathway, Andrew Butterfield, Quyen Chu, Nick Tokotch, Robert Haddick, Jean-Marc Peallat, Chrys Shea and Prashant Chouta

• Soldering Materials
  BGA Assembly with Low-Ag Alloy Spheres
  It is possible – under certain process and assembly conditions. However, assemblers must be aware of the impending change, best communicated through a part number change.
  Girish Wable and Paul Neathway

• Selective Soldering
  Selective Soldering for High-Volume Assembly
  In an EMS environment, selective soldering, using a nozzle pattern, eliminated masking, excessive flux and pallet washing. Solder splashes were eliminated, and overall quality improved drastically.
  Frank Grimard

FIRST PERSON

• Caveat Lector
  Motivating the next generation.
  Mike Buetow

• Talking Heads
  Solectron’s Jasbir Bath.

TECH TALK

• Screen Printing
  Customizing the printer.
  Dr. Rita Mohanty

• Better Manufacturing
  Leave the Windex in the cabinet.
  Dr. H.J. Zapfardt

• Wave Soldering
  Is bridging random or not?
  Gerjan Diepstraten

• Pb-Free Lessons Learned
  PWB positional inaccuracies.
  Chrys Shea

• Tech Tips
  A ROSA by any other name.
  American Competitiveness Institute

• Process Doctor
  Post-selective soldering heating benefits.
  Terry Munson

• Getting Lean
  Seeing is believing.
  Robert Hemmant

• Eastern Approaches
  SMT traceabilities.
  Cai San Qiang

• Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Productronica Product Preview
Assembly Insider
Ad Index

On the cover: Tombstoning is an omen for process engineers. (Photos courtesy Jabil)