June 2008 Issue Print E-mail
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Saturday, 31 May 2008 19:00
June 2008 cover

FEATURES

  • Nepcon China
    China Goes ‘Upmarket’
    Among Chinese suppliers, the learning curve is clearly shortening, making the annual Shanghai show a must-see. But can what some call the world’s leading SMT show fend off a competitive challenge?
    By Mike Buetow

  • Inovar
    Out of the Garage
    The snow-capped mountains of Cache Valley provide an eye-pleasing backdrop to a cresting EMS company.
    By Mike Buetow

  • Cover Story
    Improving Production Line Performance
    Balanced lines are thought to be standard for efficient production, yet in some cases, the total buffer capacity has to be spaced unevenly. The latest research shows why deliberately unbalancing the buffers may be beneficial.
    By Dr. Sabry Shaaban and Dr. Sarah Hudson

  • Productivity Tools
    Manufacturing Steps Onto the Enterprise IT Stage
    The concept of a single, comprehensive information solution collapses when one enters the manufacturing, quality and process engineering offices, and certainly the factory floor. This has led to a new category of “enterprise level” tools called manufacturing operations system (MOS) software.
    By Jason Spera

  • Wave Control
    Measuring and Controlling Wave Height and Dwell Time
    When something changes in the process, the solder wave is often the culprit. A novel direct measurement, closed-loop system can resolve problems regulating critical parameters such as wave height and dwell time.
    By Ken Kirby

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Assembly Insider

On the cover: Correctly designed unbalanced lines can increase throughput. (Photo by Tom Mc Nemar)


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Last Updated on Friday, 27 June 2008 10:46
 

Columns

Semblant Warms to New Fluoropolymer Conformal Coating

Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week.

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ECTC in Las Vegas

What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here.

This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31.

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Features

The Impact of Reel Splicing Kits on Setup and Changeover

Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way.

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Standard Solar Cells vs. Next-Gen Cells: Which is Winning?

Overcapacity is stalling the rate of improvement, but only for so long.

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Products

Viscom Announces SI 7.46 AOI Software Release
Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use...