| Report: IC Packaging Market Topped $27B in 2006 |
|
|
| Monday, 07 May 2007 09:18 | |||
|
SAN JOSE, CA – With 137 billion ICs produced, the value of the worldwide IC packaging market was $27.3 billion in 2006, reports Electronic Trend Publications in its Worldwide IC Packaging Market, 2007 Edition. Growth will reportedly continue to occur through 2008, with a probable slowdown in 2009, says the researcher. The worldwide semiconductor industry is expected grow to 216 billion ICs in 2011, with the value of the IC packaging market growing to $41 billion, a CAGR of 8.4%. ETP’s report also found that nearly 44 billion ICs were assembled by contract packaging companies in 2006, for a value of $10.3 billion – a worldwide total of 32%. Contractor volume is expected to grow to 78.3 billion packages in 2011, a CAGR of 12.3% and revenue of $19.1 billion. ETP believes IC revenue growth should nearly equal unit growth over the forecast period, provided the industry is cautious in the addition of capacity.
|
|||
| Last Updated ( Wednesday, 09 May 2007 05:08 ) |
Columns
| No Main Point |
Check out this exchange from Jabil's recent quarterly conference call: |
| Read more... |
| Steve Case, RIP |
Our deepest sympathies to the friends and family of CyberOptics founder Steve Case, who died in a plane crash Tuesday. |
| Read more... |
Features
| Cell Efficiency is Key to Success of Photovoltaics |
| The iNEMI Roadmap spells out the plan for lowest cost per watt. |
| Read more... |
| BGA Reballing Reliability |
| A study of multiple reball processes looks at copper dissolution and functionality. |
| Read more... |
Products
Young Jin Features Link Conveyors
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has...
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has...


