| Report: IC Packaging Market Topped $27B in 2006 |
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| Monday, 07 May 2007 09:18 | |||
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SAN JOSE, CA – With 137 billion ICs produced, the value of the worldwide IC packaging market was $27.3 billion in 2006, reports Electronic Trend Publications in its Worldwide IC Packaging Market, 2007 Edition. Growth will reportedly continue to occur through 2008, with a probable slowdown in 2009, says the researcher. The worldwide semiconductor industry is expected grow to 216 billion ICs in 2011, with the value of the IC packaging market growing to $41 billion, a CAGR of 8.4%. ETP’s report also found that nearly 44 billion ICs were assembled by contract packaging companies in 2006, for a value of $10.3 billion – a worldwide total of 32%. Contractor volume is expected to grow to 78.3 billion packages in 2011, a CAGR of 12.3% and revenue of $19.1 billion. ETP believes IC revenue growth should nearly equal unit growth over the forecast period, provided the industry is cautious in the addition of capacity.
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| Last Updated on Wednesday, 09 May 2007 05:08 |
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Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material. Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...
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