| Juki’s FX-3 Modular Chipshooter |
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| Written by Equipment Advances | |||
| Friday, 29 February 2008 19:00 | |||
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Eqipment Advances The component placement range is from 01005 (0402 metric) through 33.5 mm sq. Each head is driven by an overhead x-y dual gantry positioning system with closed-loop independent linear servomotors and magnetic linear encoders. The y beam has dual synchronized linear motors for each station, both left and right. Each nozzle is controlled with independent z and u AC servomotors featuring new encoders with a resolution of 260,000 pulses per revolution, for reliability and accuracy. Control of each nozzle is possible without affecting other nozzles. This reportedly aids machine uptime, as well as time between repairs. The design results in a placement rate of 60,000 cph (0.06 sec./chip), according to IPC-9850. The head unit is equipped with a new precision laser alignment and control system for both upper and lower rotary axes to improve efficiency. Placement is done via exclusive laser centering using the new CyberOptics LNC60 system. The LNC60 laser uses novel Tangent Line Centering, which takes multiple views of the component by rotating it 360° through the laser to achieve a full outline of the component. The LNC60 measures the component’s center, dimensions and angular correction in a single sweep. The machine features 1 µm linear encoders on the x and y axes. Combined, these enhancements improve placement accuracy to ±50 µm (Cpk >/= 1).Other important features of the LNC60 laser include the exact height of the nozzle tip, bent nozzle detection, and a tombstone pick. Additionally, it ensures a component is present before placement, and that the component has been placed successfully. The LNC60 laser measures components while they move from the pick to the placement site and never requires moving to a stationary camera or Line Scan Camera because it is built into the head, creating an efficient method of component measurement. The optical design of this laser has been simplified to provide higher reliability in a thinner and lighter package. The head unit is designed for easy maintenance. Vacuum filters have been moved for better access and reportedly require no adjustments or calibrations after replacement. Laser centering measures the components on the side. It is not affected by variations of component color or width/length; unlike vision centering, there is no need to edit component data for different component vendors. Component data can be completed by entering approximate dimensions, type and packaging information. The exact dimensions and lead count/pitch are measured by the machine and automatically entered into the component data. A vacuum self-calibration function eliminates the need for a vacuum “blowing-off” during placement, which can disturb neighboring components or solder paste. Standard features include:
Available from Juki Automation Systems, jas-smt.com.
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The head unit is equipped with a new precision laser alignment and control system for both upper and lower rotary axes to improve efficiency. Placement is done via exclusive laser centering using the new CyberOptics LNC60 system. The LNC60 laser uses novel Tangent Line Centering, which takes multiple views of the component by rotating it 360° through the laser to achieve a full outline of the component. The LNC60 measures the component’s center, dimensions and angular correction in a single sweep. The machine features 1 µm linear encoders on the x and y axes. Combined, these enhancements improve placement accuracy to ±50 µm (Cpk >/= 1).