| Report: System-on-Chip Challenges IP Firms |
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| Friday, 28 March 2008 07:53 | |||
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BOSTON – A new report notes that the semiconductor design IP sector grew to $1.5 billion in revenue in 2007, up approximately 11% year-over-year, a slower growth than in previous years. Yet in a twist, the success of IP for RF and wireless applications has indirectly contributed to slower growth for the semiconductor design IP sector overall, says a new report. Research firm Strategy Analytics claims, “Getting even a fraction of the IP cores on offer by more than 90 firms to work together, especially in SoCs for wireless devices, is a difficult challenge, but one made easier if done under one roof.”
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Columns
| RoHS's Side Benefits |
I have mentioned numerous times that the first purpose of RoHS is to help make recycling easier. So RoHS was developed to support WEEE. One would imagine that, in doing this, the EU was primarily concerned with recycling in the EU. |
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| 2001 vs. 2009: Why Semis Did Better This Time |
The Great Recession that began in the fourth quarter of 2008, at the height of the holiday spending season, had an enormous effect on world economies in 2009. The bursting of the bubble housing market in the US resulted in the meltdown of financial institutions around the world. |
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Features
| Capacitor Testing Challenges and Solutions |
Chip caps are prone to leakage, so consider these test methods for minimizing electrical failures. |
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| 5 Issues Driving the Cost of Poor Quality |
Why common metrics fail to root out the causes, and actually add cost in the process. |
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Products
Fujiploy Offers Sarcon GR-Tac
Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material. Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...
Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material. Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...


