| Report: IC Packaging Topped $30B in 2007 |
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| Tuesday, 13 May 2008 06:50 | |||
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SAN JOSE, CA – The worldwide IC packaging market reached $30.5 billion in 2007, reports Electronic Trend Publications. Some 151 billion ICs were produced during the year. Modest growth should continue in 2008 and 2009, before accelerating in 2010, the firm says. ETP found contract-packaging companies assembled nearly 49 billion ICs last year, or one-third of all components – for a value of $12.1 billion. The firm estimates the worldwide semiconductor output will grow to 261 billion ICs in 2012, a value of $47 billion.
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Young Jin Features Link Conveyors
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has...
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has...
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