| Report: IC Packaging Topped $30B in 2007 |
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| Tuesday, 13 May 2008 06:50 | |||
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SAN JOSE, CA – The worldwide IC packaging market reached $30.5 billion in 2007, reports Electronic Trend Publications. Some 151 billion ICs were produced during the year. Modest growth should continue in 2008 and 2009, before accelerating in 2010, the firm says. ETP found contract-packaging companies assembled nearly 49 billion ICs last year, or one-third of all components – for a value of $12.1 billion. The firm estimates the worldwide semiconductor output will grow to 261 billion ICs in 2012, a value of $47 billion.
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Columns
| RoHS's Side Benefits |
I have mentioned numerous times that the first purpose of RoHS is to help make recycling easier. So RoHS was developed to support WEEE. One would imagine that, in doing this, the EU was primarily concerned with recycling in the EU. |
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| 2001 vs. 2009: Why Semis Did Better This Time |
The Great Recession that began in the fourth quarter of 2008, at the height of the holiday spending season, had an enormous effect on world economies in 2009. The bursting of the bubble housing market in the US resulted in the meltdown of financial institutions around the world. |
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Features
| Capacitor Testing Challenges and Solutions |
Chip caps are prone to leakage, so consider these test methods for minimizing electrical failures. |
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| 5 Issues Driving the Cost of Poor Quality |
Why common metrics fail to root out the causes, and actually add cost in the process. |
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Products
Fujiploy Offers Sarcon GR-Tac
Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material. Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...
Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material. Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...


