| Endicott, Schools to Pioneer Microelectronics Manufacturing R&D |
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| Friday, 13 June 2008 08:18 | |||
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ENDICOTT, NY – Endicott Interconnect Technologies, in concert with Binghamton University and Cornell, has launched the Center for Advanced Microelectronics Manufacturing. The joint project intends to pioneer microelectronics manufacturing research and development in a roll-to-roll format. These efforts are expected to result in flexible, rugged, lightweight electronic components and innovative products critical in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking. “R&D is our engine for the creation of new products and intellectual property, as well as an important tool for solving today’s manufacturing issues,” said James McNamara, president and CEO of EI. “This collaboration between industry and academia has resulted in a truly impressive CAMM facility that will be the backbone of tomorrow’s electronics and helps to support our long-range technology efforts.” CAMM will also provide large-scale testing whereby academic and industrial research groups can test their work for manufacturing applicability.
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| Last Updated on Friday, 13 June 2008 08:19 |
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Fujiploy Offers Sarcon GR-Tac
Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material. Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...
Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material. Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...
