| Tessera Announces Technology Symposium Series |
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| Monday, 28 July 2008 11:31 | |||
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SAN JOSE – Tessera Technologies announced its fifth annual technical symposium series will highlight the power of integration. The Tessera Technology Symposiums will feature speakers from consumer electronics manufacturers and OEMs, as well as market research firms. During the event, Aptina, Asia Optical, Samsung, Toshiba and research firm IDC will discuss The Future of Imaging in Converged Mobile Devices; Transforming Mobile Devices Through High-End Imaging; Integration Challenges of Converged Devices, and Enhancing Camera Phone Performance. The symposia will be held in Hsinchu City, Taiwan on Sept. 23; Tokyo on Sept. 25, and San Jose on Jan. 26.
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| Last Updated ( Monday, 28 July 2008 11:32 ) |
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Young Jin Features Link Conveyors
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has...
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has...


