| Zestron Promises New Technologies, Larger Presence in '09 |
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| Tuesday, 06 January 2009 11:59 | |||
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MANASSAS, VA – Zestron this year will introduce several first-of-its-kind product technologies and will expand its engineering teams in each of its three facilities worldwide, the company said today. “Zestron will pursue its investment in personnel and its organization in 2009 to be well situated when the global economy recovers,” said Dr. Harald Wack, vice president and CEO of Zestron America. In its most recent move, Zestron Europe in December moved into a 36,000 sq. ft. facility in Ingolstadt, Germany, said to house Europe’s largest technical and analytical center, at more than 10,000 sq. ft.
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| Last Updated ( Tuesday, 06 January 2009 12:14 ) |
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Young Jin Features Link Conveyors
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has...
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has...
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