| Semiconductor Manufacturing and Test Equipment (North America) |
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| Written by SEMI | |||
| Tuesday, 19 July 2011 11:20 | |||
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Monthly report tracking billings and bookings (book-to-bill) worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices (does not track billings and bookings of semiconductors). Categories covered include front-end (wafer processing/mask/reticle/wafer manufacturing/fab facilities) equipment and final manufacturing (assembly/packaging/test) equipment. Data are provided on a 90-day moving average basis. This is considered a leading indicator of future printed circuit board and electronics assembly orders.
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| Last Updated on Thursday, 23 May 2013 08:45 |
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Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board...
