| Semiconductor Manufacturing and Test Equipment (Worldwide) |
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| Written by SEAJ, SEMI, Gartner | |||
| Thursday, 21 July 2011 10:03 | |||
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Monthly report tracking billings and bookings (book-to-bill) worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices (does not include billings and bookings of semiconductors). Categories covered include front-end (wafer processing/mask/reticle/wafer manufacturing/fab facilities) equipment and final manufacturing (assembly/packaging/test) equipment. Data are provided on a 90-day moving average basis. This is considered a leading indicator of future printed circuit board and electronics assembly orders. Compiled by Semiconductor Equipment Association of Japan, SEMI and SEMI Japan, plus other research firms.
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| Last Updated on Friday, 14 June 2013 09:29 |
Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
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| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
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Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
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| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
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