| Electronics Failure Analysis for Pb- and Pb-Free Solder Joints |
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| Written by Dr. Ron Lasky | |||
| Thursday, 01 November 2012 19:13 | |||
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Why Weibull continues to be foundation for modeling reliability. The Weibull distribution is arguably the most important distribution in failure analysis of leaded and Pb-free solder joints. It is the first thought for someone trying to model thermal cycle, drop shock or other failure modes associated with through-hole and SMT assembly.
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| Last Updated on Monday, 05 November 2012 21:32 |
Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
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| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
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Features
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Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
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| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
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Products
Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use...




