| IPC Updates Stencil Design Standard |
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| Written by Mike Buetow | |||
| Monday, 11 June 2012 08:52 | |||
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BANNOCKBURN, IL -- IPC has released an update to its guidelines for stencil design. IPC-7525B, "Stencil Design Guidelines," provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive. The updated standard includes differences for tin-lead and lead-free solder paste, overprint, two-print and step stencil designs. The document also provides a sample order form and an inspection checklist for use in verifying that stencils have been fabricated correctly and no damage has occurred during shipping. The newly released document will help PCB designers and board assemblers address new materials and smaller, finer-pitch components, IPC said.
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