IPC Revises BGA Guideline PDF Print E-mail
Written by Chelsey Drysdale   
Wednesday, 30 January 2013 16:20

BANNOCKBURN, ILIPC has released the C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

 

It is a tool to help improve reliability of ball grid arrays and fine-pitch ball grid arrays in high-density applications.

IPC-7095C addresses design and process considerations of particular importance to portable handheld products in which BGAs are a dominant interconnection technology.

The revised document now includes expanded information on mechanical failure issues such as PCB pad cratering or laminate defects that occur after assembly. In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of Pb-free joint criteria associated with BGAs.

It also features photographs of x-ray and endoscope illustrations to identify various defect conditions such as head-in-pillow.

For more information, visit www.ipc.org/7095.

Last Updated on Friday, 01 February 2013 10:42
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

Read more...
 
The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

Read more...
 

Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Read more...
 
Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...