BANNOCKBURN, IL — A team of engineers from Agilent, Andrew Corp. and Alcatel-Lucent have won the best paper award for the upcoming IPC Apex conference.

Winners were selected through a ballot process of more than 100 papers by the event’s technical program committee. The conference takes place next week in San Diego.

Papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing.

In the US category, the winner authors are Julie Silk, Agilent; George Wenger and Andrew Giamis, Andrew; Richard Coyle, Alcatel-Lucent; and Jon Goodbread, Agilent, for "Reflow-Induced Brittle Interfacial Failures in Lead-Free Ball Grid Array (BGA) Solder Joints.”

In the International category, the winners are Polina Snugovsky, Ph.D., Eva Kosiba, Jeffrey Kennedy, Zohreh Bagheri, and Marianne Romansky, Celestica; and Michael Robinson, Joel Heebink and Joseph Juarez, Jr., Ph.D., Honeywell, for “Manufacturability and Reliability Screening of Lower Melting Point Lead-Free Alloys Containing Bismuth.”