| Flextronics Opens Product Innovation Center in Silicon Valley |
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| Written by Chelsey Drysdale | |||
| Thursday, 14 February 2013 17:34 | |||
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MILPITAS, CA – Flextronics is investing millions in a Product Innovation Center here, where it will explore technologies ranging from 3D plastic printing to high-end packaging. The firm has invested $12 million to date in equipment and capabilities at the site, and has committed an additional $20 million for the coming months.
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Columns
| Semblant Warms to New Fluoroolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
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| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
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Features
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Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
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| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
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Products
TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of...



