January Semi B2B At Highest Mark Since Fall 2010 PDF Print E-mail
Written by Mike Buetow   
Friday, 22 February 2013 01:23

SAN JOSE — North America-based semiconductor equipment manufacturers saw orders outpace shipment revenues in January for the first time since last spring, raising hopes that a recovery is imminent.

For the month, the 90-day moving average orders worldwide was $1.09 billion, up 17.2% from revised December levels and 8.5% below last year's pace.

Worldwide billings were down 23.2% from a year ago and 5.4% from last month to $952.1 million.

The book-to-bill ratio jumped to 1.14, the first time since May 2012 that the ratio topped the benchmark 1.0 level, and the highest mark since September 2010. A book-to-bill of 1.14 means that $114 worth of orders were received for every $100 of product billed.

 

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill

August 2012

1,331.5

1,092.9

0.82

September 2012

1,164.4

912.8

0.78

October 2012

985.5

742.8

0.75

November 2012

910.1

718.6

0.79

December 2012 (final)

1,006.1

927.4

0.92

January 2013 (prelim)

952.1

1,086.7

1.14

Source: SEMI, February 2013

 


blog comments powered by Disqus
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

Read more...
 
Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

Read more...
 

Features

Managing Your ESD Program

The processes are as important as the tools.

Read more...
 
SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Alpha Introduces Lumet LED Materials
Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board...