LPKF Webinar Explores 3D Circuitry on Thermoplastics PDF Print E-mail
Written by Chelsey Drysdale   
Thursday, 11 April 2013 13:46

TUALATIN, ORLPKF will host a webinar Apr. 18 on creating molded interconnect devices (MIDs) with laser direct structuring.

LPKF market development representative Shane Stafford will present the webinar with Stephan Schmidt, president of LPKF North America, and Don Porter, LPKF global accounts manager.

3D molded interconnect devices are thermoplastic parts that combine circuitry, connectors, and housing into a single part. In the webinar, viewers will learn how MIDs use both mechanical and electrical design and the benefits they carry. Laser direct structuring is a three-step process for manufacturing MIDs. LDS has the ability to etch complex circuitry onto the surface of MIDs.

The presentation will run approximately 30 min. and will be followed by a Q&A.

For more information, visit: http://www.lpkfusa.com/mid/webinars/3D-Circuitry-on-Thermoplastics.html.

To register for the free event, visit: https://www3.gotomeeting.com/register/624404198.
 

 

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