Samsung Issued Patent for Molded FC Package on Bumped Board PDF Print E-mail
Written by Mike Buetow   
Thursday, 05 December 2013 09:09

ALEXANDRIA, VA -- A quartet of Samsung engineers have been issued a US patent for a molded underfill flip chip package in which a semiconductor chip is mounted on a printed circuit board through bumps. The invention will prevent or reduce warpage and voids in the semiconductor package so as to increase reliability of the semiconductor package, the inventors said in the patent filing.

Per the filing: "In accordance with an example embodiment, a molded underfill flip chip package may include a printed circuit board, a semiconductor chip mounted on the printed circuit board, and a sealant. The printed circuit board has at least one resin passage hole passing through the printed circuit board and at least one resin channel on a bottom surface of the printed circuit board, the at least one resin channel extending from the at least one resin passage hole passing through the printed circuit board. The sealant seals a top surface of the printed circuit board, the semiconductor chip, the at least one resin passage hole, and the at least one resin channel.

"In accordance with an example embodiment, a molded underfill flip chip package may include a printed circuit board including at least one resin channel extending on a bottom surface of the printed circuit board, a semiconductor chip mounted on the printed circuit board through bumps, and a sealant sealing a top surface the printed circuit board, the semiconductor chip, and the at least one resin channel."

The inventors are Yu Hae-jung, Kim Hyeong-seob, Lee Jong-ho and Park, Jin-woo.

The patent number is 8592997 and the assignee is Samsung Electronics.

 

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