Test Demand Drives Datest Growth PDF Print E-mail
Written by Mike Buetow   
Friday, 31 January 2014 10:15

FREMONT, CA — Datest today said sales rose 15% year-over-year in 2013. The privately held PCB test, test engineering, and inspection company attributed the growth to nearly 60 new accounts won during the year.

The majority of Datest’s new accounts selected Datest for its 2D and 3D X-ray and 3D CT-scan failure analysis services, the firm said, to address board-level reliability problems.

“Board-level reliability is a ticking time bomb in our industry,” said Robert Boguski, president. “Every day our booming 3D quick-response failure analysis work produces overwhelming evidence that apparent good boards, having passed the requisite electrical and burn-in tests at assembly, are failing in the field, often because of solder joint defects in high density packages like BGAs and QFNs. Engineers approach Datest with suspicions regarding these defects on their boards, and more often than not, we confirm them. More importantly, we provide clarity and help set a direction for them to make vital process and yield improvements.”

Ed.: Boguski authors a regular column on testing for CIRCUITS ASSEMBLY.


 

 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

Read more...
 
The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

Read more...
 

Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Read more...
 
Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...