| December PCB Shipments Down, Orders Up |
 |
 |
 |
| Tuesday, 29 January 2008 05:55 | |||
|
BANNOCKBURN, IL – North American circuit board shipments fell 5.4% year-over-year in December, while orders rose 5.5%. For the year, shipments were down 8.7%, while bookings fell 6.3%, IPC said. For the month, rigid shipments were down 5.9% and bookings were up 6.8% compared to 2006. For the year, shipments were down 8.9% and bookings were down 7%. Sequentially, shipments increased 8% and bookings increased 3.1%. The book-to-bill ratio was 1.01. Flex circuit shipments were up 1% in December, while bookings were down 9.7% year-over-year. For the year, flex circuit shipments were down 5.7% and bookings were up 4%. Sequentially, flex shipments were up 5.6% and bookings rose 2.2%. The book-to-bill was 1.0. Compared to November, all shipments were up 7.8% and bookings were up 3.1%. The book-to-bill ratio fell to 1.01.
|
|||
| Last Updated on Tuesday, 29 January 2008 05:56 |
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
Search
Search
Login
CB Login
Language
Language
Products
EMS Introduces 535-18M-57 UV Cure Adhesive
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
