TechSearch Forecasts Realistic 3-D TSV Market PDF Print E-mail
Tuesday, 12 February 2008 05:02
AUSTIN, TX – Applications for 3-D TSV, including image sensors, flash, DRAM, processors, FPGAs and power amplifiers, will be adopted, but the timing for mass production depends on how the cost compares with that of existing technologies, says TechSearch International in a new report.
Image sensors for camera modules are already in volume production, but for other applications, the adoption time is longer than originally predicted, as is common with the introduction of many new technologies, the company says. Design, thermal and test issues remain a barrier to TSV adoption in some applications, though progress is being made.
The report, “Through Silicon Via Technology: The Ultimate Market for 3D Interconnect,” provides a timeline for the adoption of TSV in these applications. The report forecasts market size in units and number of wafers for each application area.
Driven by the need for improved performance and reduced timing delays, methods have been developed to use short vertical interconnects instead of the long interconnects used in 2-D structures. The industry is moving past the feasibility (R&D) phase for TSV technology and into commercialization, where economic realities will determine which technologies are adopted, says the firm. Low-cost fine via hole formation and reliable via filling technologies have been demonstrated; process equipment and materials are available.


Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.



Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.





CB Login



English French German Italian Portuguese Russian Spanish


Techspray Introduces Fine-L-Kote High Viscosity AR Conformal Coating
Fine-L-Kote high viscosity AR acrylic conformal coating reportedly widens the process window and flexibility. Can use as-is for dipping or thin down for spray systems. Is for selective spray systems...