| Design Cycle Time Reduction Webinar Series Scheduled |
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| Thursday, 14 February 2008 06:23 | |||
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SMYRNA, GA – Reduce Cycle Time Up to 60% for PCB Placing and Routing, a 60-minute free Webinar, will be held Feb. 26 at 2 p.m. EST, UP Media Group announced. The Webinar will illustrate innovative design-tool technologies that enable multiple designers, operating on a LAN or WAN network, to perform simultaneous placement and routing on the PCB. This is the first in a series of Webinars addressing how to efficiently design complex PCBs. David Wiens, a Mentor Graphics product manager with 20 years’ experience in EDA, will present. To register, visit www.pcbshows.com/webinars/events/mentor/xtremedesign.html.
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Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
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Inventec Releases SnBiAg Solder Paste
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
