Assembly Research Consortium to Meet on Process and Reliability Issues PDF Print E-mail
Friday, 22 February 2008 05:24
OWEGO, NY – The Advanced Research in Electronics Assembly Consortium will gather Feb. 27-28 to review this year’s research plan and to review results of recent investigations.
Attendees from more than 30 companies and institutions are expected to attend the two-day workshop in Owego for an in-depth look at process and reliability-related research in electronics assembly.
During the workshop, Unovis researchers will review their 2007 findings pertaining to the consortium’s research tracks. Progress reports will highlight development in the consortium’s lead-free studies. Reliability issues pertaining to surface finishes, underfilling and repair will also be discussed. Also, recent investigations on TSV stacking will be presented.
Last Updated on Friday, 22 February 2008 05:24


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