| Design Cycle-Time Reduction Webinar Today |
 |
 |
 |
| Written by Mike Buetow | |||
| Tuesday, 26 February 2008 05:16 | |||
|
SMYRNA, GA -- Mentor Graphics will illustrate ways to cut design cycle time by 60% or more for board placing and routing in a free Webinar today at 2 pm EST. This presentation will describe some unique and innovative design-tool technologies that enable multiple designers, operating on a LAN or WAN network, to perform simultaneous placement and routing on the PCB. Users of this technology are reportedly experiencing more than a 60% reduction in layout times. The Webinar will explain details of the technology and provide a short demonstration of multiple designer operations. Register online here. For more information on this Webinar, click here.
|
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
Search
Search
Login
CB Login
Language
Language
Products
EMS Introduces 535-18M-57 UV Cure Adhesive
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
