| Call for Papers Issued for COTS Conference |
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| Wednesday, 27 February 2008 05:51 | |||
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SCHAUMBURG, IL – Papers are sought for the International Military & Aerospace/Avionics COTS Conference, Exhibition and Seminar, to be held Aug. 4-6 in Schaumburg, IL. Papers are sought on commercial plastic-encapsulated components for use in high reliability applications. Specific topics may include reliability; testing; implementation; development; processing; specification generation; procurement (market, sourcing and supply problems); radiation hardness; Pb-free applications, and prognostics. Abstracts are due April 18 and must include the title, author(s), affiliation and address. After acceptance, material to be included on a conference proceedings CD is required by July 18.
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| Last Updated on Wednesday, 27 February 2008 05:53 |
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Inventec Releases SnBiAg Solder Paste
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
