| Stack/POP Assembly Workshop Announced |
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| Monday, 10 March 2008 06:02 | |||
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OXFORDSHIRE, UK – A workshop covering stack/package on package, aimed at the next generation of design and assembly engineers, will take place May 1 in Oxfordshire. Presented by SMART Group and IMAPS, the event is aimed at engineers; designers; production; quality and inspection engineers. The workshop is also for managers who would benefit from a better understanding of the coating process. For more information, visit www.smartgroup.org/pdf/popassembly.pdf. To book a tabletop exhibition space, visit www.smartgroup.org/pdf/TableTopSpace2004.pdf.
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| Last Updated on Monday, 10 March 2008 06:03 |
Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
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| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
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Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
| Read more... |
| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
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Products
Viscom Announces SI 7.46 AOI Software Release
Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use...
Software release SI 7.46 reduces AOI inspection times through improved optimization of travel paths. Integrates Library Manager to assign new inspection patterns more quickly and easily, easing use...



