| 6th Annual MEMS Symposium Announced |
|
|
|
| Wednesday, 12 March 2008 04:24 | |||
|
SAN JOSE – The MicroElectronics Packaging and Test Engineering Council will hold its 6th Annual MEMS packaging symposium on May 22. The one-day event will take place at the Wyndham Hotel in San Jose, and will explore new applications, market opportunities, and enabling technologies for MEMS, including emerging biomedical and consumer sectors. The program will include talks on MEMS and the consumer, automotive and biomedicine markets, and on the impact of wafer-level packaging and 3-D ICs on foundries and the industry. Fore more information, visit www.meptec.org.
|
|||
| Last Updated on Wednesday, 12 March 2008 04:25 |
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
Products
Alpha Introduces Lumet LED Materials
Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board...
Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board...



