| Rigid PCB Bookings Up 15.6% in February |
 |
 |
 |
| Thursday, 27 March 2008 10:43 | |||
|
BANNOCKBURN, IL – February PCB shipments among North American fabricators fell 0.3% and bookings jumped 15.4% year-over-year, IPC reported today. Year-to-date, combined industry shipments are up 1.8%, while bookings are up 13.3%. Sequentially, combined industry shipments for the month were up 3% and bookings were up 21%. The book-to-bill moved up to 0.99, meaning that for every $100 boards sold, $99 in orders were received. Rigid PCB bookings were up 15.6% and shipments were down 0.7% year-over-year, IPC said. Year to-date, rigid PCB shipments are up 2.3% and bookings are up 14.7%. Sequentially, rigid PCB shipments increased 1.7% and rigid bookings increased 20.6%. The rigid book-to-bill ratio crept up to 0.99, said IPC. Flexible circuit shipments in February were up 5.9% and bookings were up 12.4% compared to the same month last year. Year to-date, flex circuit shipments are down 6.2% and bookings are off 5.1%. Compared to the previous month, flexible circuit shipments were up 25.3% and flex bookings rose 27.7%. The flex book-to-bill ratio held steady at 0.96.
|
|||
| Last Updated on Thursday, 27 March 2008 10:44 |
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
Search
Search
Login
CB Login
Language
Language
Products
Alpha Introduces Lumet LED Materials
Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board...
Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board...
