| Report: System-on-Chip Challenges IP Firms |
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| Friday, 28 March 2008 07:53 | |||
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BOSTON – A new report notes that the semiconductor design IP sector grew to $1.5 billion in revenue in 2007, up approximately 11% year-over-year, a slower growth than in previous years. Yet in a twist, the success of IP for RF and wireless applications has indirectly contributed to slower growth for the semiconductor design IP sector overall, says a new report. Research firm Strategy Analytics claims, “Getting even a fraction of the IP cores on offer by more than 90 firms to work together, especially in SoCs for wireless devices, is a difficult challenge, but one made easier if done under one roof.”
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Products
EMS Introduces 535-18M-57 UV Cure Adhesive
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....



