| Unimicron to Manufacture Endicott’s CoreEZ |
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| Friday, 28 March 2008 09:18 | |||
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ENDICOTT, NY – Endicott Interconnect Technologies has entered into a sales and manufacturing agreement under which Unimicron Technology will produce CoreEZ organic substrates. No financial terms were announced. Under terms of the agreement, EI maintains control of design and technical support for CoreEZ. Unimicron will manufacture substrates at one of its Taiwanese facilities. The two companies will handle sales jointly.
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| Last Updated on Friday, 28 March 2008 09:19 |
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Polyonics Introduces Double Coated Bonding Tapes
Ultra thin double coated tapes are for bonding and attaching components and assemblies where high dielectric strength is required. REACH and RoHS compatible. Come in polyimide (PI) and polyester...
Ultra thin double coated tapes are for bonding and attaching components and assemblies where high dielectric strength is required. REACH and RoHS compatible. Come in polyimide (PI) and polyester...
