| IPC Revises BGA Spec |
 |
 |
 |
| Friday, 18 April 2008 09:27 | |||
|
BANNOCKBURN, IL – IPC has released IPC-7095B, Design and Assembly Process Implementation for BGAs. This revised document focuses on applications that use both SnPb and Pb-free on the same board, including various solder ball alloys, new laminate materials for Pb-free, BGA trace escape and routing considerations during board design to improve yield and reduce cost,” explained Ray Prasad, task group chairman. “There is also a detailed discussion of reflow solder profiling, void process indicators and ways to improve product reliability,” he said The standard was approved by consensus last month, said Prasad, who is also principal of Ray Prasad Consultancy Group, in a statement.
|
|||
| Last Updated on Friday, 18 April 2008 09:27 |
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
Search
Search
Login
CB Login
Language
Language
Products
Kolb Releases PS300 2HY Stencil Cleaner
PS300 2HY hybrid batch stencil cleaner is suitable for stencils, PCBs, misprints and solder frames. Is an automatic single-chamber system; features 3-4 step PowerSpray cleaning. Is part of compact...
PS300 2HY hybrid batch stencil cleaner is suitable for stencils, PCBs, misprints and solder frames. Is an automatic single-chamber system; features 3-4 step PowerSpray cleaning. Is part of compact...
