Call for Papers Issued for SMTA China Conferences PDF Print E-mail
Thursday, 24 April 2008 08:28
EDINA, MNSMTA has issued a call for papers for SMTA China South (Aug. 26-28) and SMTA China North (Nov. 10-11).
These events will be held in conjunction with Nepcon South China and Bohai Electronics Week.
Topics to be covered include 01005 and chip-scale-package assembly; 3D SiP; challenges of PCB fabrication technology and surface finish; component supply integrity; cost reduction initiative; advanced low I/O packaging; flex circuit assembly; market trends in assembly manufacture; manufacturing engineering; materials and process characterization; Pb-free processes and product reliability; package on package; process control excellence; production and supply chain management; RoHS compliance and materials; risk-free rework/repairing, and inspection and failure analysis.
SMTA requests technical papers for the technology or vendor conferences. Papers are requested in both Chinese and English; Chinese presentations are recommended.
The deadline for abstracts for China South is May 15, and for China North, July 10.
Submit abstracts to This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
Last Updated on Thursday, 24 April 2008 08:31


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