| Intel, Others Escape China Quake |
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| Written by Mike Buetow | |||
| Wednesday, 14 May 2008 06:39 | |||
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CHENGDU, CHINA -- Major electronics manufacturers escaped damage from the massive earthquake that rocked central China earlier this week. Among the major companies issuing statements, it appears the worst of the damage amounted to a few fallen ceiling tiles. Staff and inventories at Intel's chip test and assembly plant in Chengdu were unhurt, a company spokesman said, although the company shut down operations temporarily at its in order to assess possible damage. Chengdu is 55 miles south of the quake's epicenter. Intel's Chendgu plant is built to earthquake standards. In Suzhou, about 600 miles east of the epicenter, some companies are reporting plant closures for inspections, among them Advanced Micro Devices, but no injuries or damage has been reported. IBM and Flextronics reported no injuries to employees and no damage to its facilities. Comment on this story here.
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| Last Updated on Wednesday, 14 May 2008 07:38 |
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EMS Introduces 535-18M-57 UV Cure Adhesive
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
