PWB Shipments Up 13% in April PDF Print E-mail
Tuesday, 27 May 2008 09:33
BANNOCKBURN, IL – April PWB shipments rose 12.9% year-over-year, and bookings 4.8% over last year, IPC reported today.
 
Year to date, shipments were up 6.5% and bookings 10.6%. Shipments were down 14.6% and bookings were off 19.1% versus March.
 
The book-to-bill edged up above parity, to 1.01. A ratio of more than 1.0 suggests demand is ahead of supply and is considered a sign of a rising market.
 
About 13% of the data are imported boards resold by North American fabricators.
 
Rigid PCB shipments, which make up 88% of sales, were up 12.2% and bookings were up 5.6% over last year.
 
Year to date, rigid shipments were up 6.6% and bookings were up 12.9%. Rigid shipments decreased 14.7% and bookings decreased 19.3% versus March.
 
Flexible circuit shipments in April were up 22.8%, while bookings were down 4.8% year-over-year.
 
Year to date, flex shipments were up 5% and bookings were down 14.3%. Compared to the March, flex shipments were down 12.5% and bookings fell 16.8%. The flex book-to-bill ratio was flat at 0.99.
Last Updated on Tuesday, 27 May 2008 09:34
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

Read more...
 
The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

Read more...
 

Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Read more...
 
Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...