Rigid PCB Shipments Up, Bookings Down in May PDF Print E-mail
Written by Mike Buetow   
Tuesday, 01 July 2008 04:29
BANNOCKBURN, IL – North American PCB shipments rose 5.1% year-over-year in May, but orders fell 4.2%.

Through May, shipments are up 6.2%, while bookings are 7.5% higher. Compared to April, shipments were down 0.7% and bookings were down 5.2%. The book-to-bill ratio fell to 0.96.

The ratio is calculated by the value of shipments divided by bookings over the past three months. A ratio higher than 1.0 is considered a sign of an expanding market.

The data were released Monday night by IPC.

At least 14% of the boards accounted for in the IPC data were produced offshore but sold within North America. Thus, the actual production would be lower than the aggregate datasuggest.

For the month, rigid PCB shipments were up 5.7% and bookings were down 4.1% in May year-over-year. Year to date, rigid shipments are up 6.4% and bookings 9.4%. Sequentially, rigid shipments are down 0.1% and bookings are off 5.7%. The rigid book-to-bill ratio fell to 0.95. 

Flex circuit shipments were down 3.5% and bookings were off 5% compared to May 2007. Year to date, flex shipments are up 3.3% and bookings down 12.5%. Flex shipments were down 9.3% and flex bookings up 1.1% sequentially. The book-to-bill rose to 1.01.



Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.



Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.





CB Login



English French German Italian Portuguese Russian Spanish


Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...