| Nepcon China to Relocate in 2011 |
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| Written by Mike Buetow | |||
| Wednesday, 26 November 2008 05:11 | |||
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SHANGHAI -- Nepcon China will relocate to the Shanghai World Expo Venue in 2011, the show producer announced today. The WEV offers state-of-the-art infrastructure, meeting facilities, accessibility and hotel support, Reed Exhibitions asserted in a press release. The current site, the Everbright Convention and Exhibition Center, has been criticized for its electrical and dimensional liabilities and a lack of nearby hotels. The show remains one of the largest for electronics manufacturing in the world, with an estimated 16,000 attendees.
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EMS Introduces 535-18M-57 UV Cure Adhesive
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
