| Japan's Electronics Giants Expected to Report Combined Losses of $22B |
 |
 |
 |
| Wednesday, 04 February 2009 07:31 | |||
|
TOKYO – Seven of Japan's top electronics manufacturers will post losses for the fiscal year ending in March, says EE Times. Hitachi Ltd., Panasonic Corp., Sony Corp., Toshiba Corp., Fujitsu Ltd., NEC Corp. and Sharp Corp. are expected to have combined net losses of $22.3 billion.
Net profits were predicted as late as November, the publication reports. Mitsubishi Electric Corp. and Sanyo Electric Co. are the only two local firms predicting to avoid the red. Hitachi and Toshiba reportedly will report their steepest losses ever.
|
|||
| Last Updated on Wednesday, 04 February 2009 07:33 |
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
Search
Search
Login
CB Login
Language
Language
Products
EMS Introduces 535-18M-57 UV Cure Adhesive
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
