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# Article Title Date Author
191 Infrastructure Video Equipment to See Growth, Consolidation Wednesday, 06 March 2013 Mike Buetow
192 PC Outlook Poor, IDC Says Wednesday, 06 March 2013 Mike Buetow
193 Report: FCIP to Experience Unit CAGR of 26% to 2016 Tuesday, 05 March 2013 Chelsey Drysdale
194 N. American PCB Orders Down 4% in January Tuesday, 05 March 2013 Chelsey Drysdale
195 Fab Equipment Spending Remains Flat in 2013; Up 24% in 2014 Tuesday, 05 March 2013 Christian Gregor Dieseldorff, SEMI
196 Zestron, Speedline to Present Cleaning Webinar Monday, 04 March 2013 Chelsey Drysdale
197 Ducommun Posts Q4 Net Sales Up 3% YoY Monday, 04 March 2013 Chelsey Drysdale
198 McConnell, Woody Receive IPC Presidents Awards Monday, 04 March 2013 Chelsey Drysdale
199 Seasonality Stymies Semi Sales Monday, 04 March 2013 Mike Buetow
200 Flip Chip, Bumping Technologies Still Growing Monday, 04 March 2013 Mike Buetow
 
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Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Inventec Releases SnBiAg Solder Paste
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...