| EMS Introduces 561-50 Die Attach Adhesive |
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| Monday, 21 January 2013 09:23 | |||
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561-50 die attach adhesive attaches semiconductor die in temperature-sensitive devices. Is electrically conductive, and cures more than 90% cured after 30 min. at 80°C. Dispensing work life said to be greater than 48 hr. (measured as a 25% increase in viscosity). Exhibits damp heat resistance and conductivity stability. Fast cures at elevated temperatures (1 min.@180°C). For applications with high peel strength, smart cards, camera modules, flex circuits and other temperature-sensitive applications.
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Columns
| Semblant Warms to New Fluoroolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
| Read more... |
| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
| Read more... |
Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
| Read more... |
| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
| Read more... |
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TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of...
