| EMS Introduces 561-50 Die Attach Adhesive |
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561-50 die attach adhesive attaches semiconductor die in temperature-sensitive devices. Is electrically conductive, and cures more than 90% cured after 30 min. at 80°C. Dispensing work life said to be greater than 48 hr. (measured as a 25% increase in viscosity). Exhibits damp heat resistance and conductivity stability. Fast cures at elevated temperatures (1 min.@180°C). For applications with high peel strength, smart cards, camera modules, flex circuits and other temperature-sensitive applications.
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Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
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| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
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Features
| Managing Your ESD Program |
The processes are as important as the tools. |
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| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
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MPM Momentum compact printer is 30% smaller overall than standard Momentum. Configurable for dual lane and back-to-back processing. Wet print accuracy reportedly 18µm @ 6ó, Cpk>2. Reportedly...
