TI’s Journey to High-Volume Copper Wire Bonding Production Print E-mail
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Written by Texas Instruments   
Wednesday, 23 May 2012 09:07

TI’s Journey to High-Volume Copper Wire Bonding Production

Abstract: The use of copper wire bonding in semiconductor packages has seen a steady evolution in recent years. The technology offers better performance and is more economical than traditional gold wire bonding, and Texas Instruments has played an instrumental role in developing copper wire bonding across the industry. With billions of units shipped, TI offers packaging solutions that deliver the performance, reliability, quality and cost advantages of copper. Copper wire bonding is a proven, standard solution across many of TI’s analog, embedded processing and wireless products, and it is gaining broad acceptance among customers. This white paper will explore the technology’s benefits and technical challenges faced in the ramp of copper wire bonding to high volume production.

May 23, 2012

Last Updated on Wednesday, 23 May 2012 09:11
 

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