| New Product Introduction |
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| Written by Siplace | |||
| Wednesday, 01 August 2012 09:30 | |||
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By ASM Siplace New product introductions (NPIs) involve complex processes. This new publication presents solutions for everyday challenges, lots of tips and tricks, and a convenient checklist for the NPI process. It is directed toward manufacturers who want to implement robust NPI processes in their high-mix electronics production environments with consistent tool chains in order to raise the efficiency and quality of their new product introductions, which occur with increasing frequency. Readers will learn how even the first yield can be produced efficiently and error-free despite faulty Gerber data, incomplete bills of material, and missing or late component descriptions.
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Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
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| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
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Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
| Read more... |
| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
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