Assembly and Rework of Lead Free Package on Package Technology Print E-mail
User Rating: / 0
Written by Raymond G. Clark and Joseph D. Poole   
Tuesday, 23 October 2012 15:23

Assembly and Rework of Lead Free Package on Package Technology

Authors: Raymond G. Clark and Joseph D. Poole

Abstract: Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate
technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stack Save ing
packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package
(PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the
preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability
to assemble and rework numerous “state of the art” packaging technologies. This paper will focus on the essential
engineering development activities performed to demonstrate TT Electronics’ ability to both assemble and rework PoP

Last Updated on Tuesday, 23 October 2012 15:31


Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.



Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.





CB Login



English French German Italian Portuguese Russian Spanish


Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...