| Techcon Systems Introduces TS9000 Series Jet Tech Valve |
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| Written by Chelsey Drysdale | |||
| Monday, 12 November 2012 13:05 | |||
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TS9000 Series is a Piezoelectric-driven, non-contact Jet Tech valve. Handles fluid viscosities to 2 million Cps. Produces hundreds of deposits in less than one sec. Has adjustable parameter settings and a variety of nozzle shape and sizes, with different tappet configurations. Features field replaceable spare parts. Applications include jetting silver epoxies for die bonding processes, silicone phosphor in the LED assembly process, underfill in microelectronic package applications on PCBAs, and micro dots of UV adhesive in medical device applications. Is shipped standard with a valve, controller, cables and three nozzle tools. Techcon Systems, www.techconsystems.com
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Columns
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
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| ECTC in Las Vegas |
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