| Via In Pad Guidelines |
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| Written by Duane Benson, Screaming Circuits | |||
| Friday, 06 July 2007 10:24 | |||
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In the assembly world, putting vias directly in surface mount pads is often not recommended. But for routing large or fine-pitch BGAs, bypass capacitors, thermal management, and grounding on high-frequency parts, via-in-pad can be an effective, if demanding, solution.
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| Last Updated on Tuesday, 28 June 2011 13:07 |
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Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
