Failure Mechanisms in High Voltage Printed Circuit Boards Print E-mail
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Written by DfR Solutions   
Monday, 01 October 2007 06:41

Failure Mechanisms in High Voltage Printed Circuit Boards

High voltage designs often adhere to IPC, UL or MIL requirements. However, blindly following these specifications can cause heartburn when dealing with space constraints or insulation degradation experienced in severe environments. This white paper written by DfR Solutions provides clear and concise understanding of industry specifications, the mechanisms that induce failure in high voltage designs and how to avoid them.


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Last Updated on Tuesday, 28 June 2011 13:07
 

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