Circuits Assembly Online Magazine

FEATURES

Nickel Stencils
Improvements in Pb-free Stencils
When screen printing with Pb-free solder pastes, stencils made from pure nickel or a nickel alloy help to achieve paste transfer efficiency comparable to the levels achieved using SnPb pastes with stainless steel laser-cut stencils. Combined with the efficiencies of a framemounted interchangeable foil stencil system, nickel is the optimal medium for process repeatability and productivity.
Clive Ashmore and Michael Zahn
Placement Software
New Tools for High-Mix Manufacturers
Though the speed and accuracy of modern component placement systems still factor greatly in equipment evaluation, software is emerging as a differentiator. Here, a major EMS company discusses how use of new software helped it cut NPI setup by 1.5 to 2 times.
David Garfield and Steve Bowen
Cover Story
Key Issues in Supporting Customers Not Transitioning To Pb-Free
Many OEMs need to sustain leaded products for reasons of cost or reliability. This article looks at challenges associated with products that are not transitioning to Pb-free and suggests considerations for both the EMS company and the OEM.
Curt Williams
Case Study
Finding Hidden Placement Problems
High-mix, low volume EMS companies spend large amounts of time in machine setup and changeover. Using a special technology that measures machine accuracy, one EMS provider was able to improve its placement machine accuracy.
Kary Voegele
DfM Trends
Practical Steps to Reduce Total Cost of Ownership
From R&D to boxbuild, the telecom equipment supply chain is highly complex. Yet many OEMs fail to bring their EMS providers into the process until a new product is ready for volume production. Hereâ€™s how to fix that.
Petra Ebner