December 2009 Issue
FEATURES
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ATE Boards
Processes for Building Test Boards
Test load board assembly has unique nuances and quirks that most assemblers may not properly translate.
by Marilyn Ta -
KeyTronicEMS
Of Mice and Men
In the topsy-turvey world of electronics manufacturing services, KeyTronicEMS has turned 23 straight quarterly profits. For its unique but systematic approach to the EMS rollercoaster, and its stellar performance in all types of environments, KeyTronicEMS is our 2009 EMS Company of the Year.
by Mike Buetow -
Paste Deposition
Optimizing Solder Paste Printing
Counterintuitively, the trend analysis shows keep-out distance has little or no effect on paste transfer efficiency and height for 0402 and SOP type pads.
by the iNEMI Solder Paste Deposition Group -
Cover Story
PoP Assembly Process Fundamentals
Package stacking is proving ideal for a variety of applications requiring greater functionality, higher performance and a smaller footprint: Stacking pre-tested package sections enables a high degree of flexibility for designers, permitting virtually any combination of memory to be combined with any logic chipset.
by Vern Solberg and Phil Damberg -
Retrospective
In Memoriam
A look back at friends and colleagues who left us in 2009.
by Mike Buetow - Circuits Assembly 2010 Buyers Guide
FIRST PERSON
- Caveat Lector
Productronica productive, foretelling.
Mike Buetow
MONEY MATTERS
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Sherman's Market
The near-term EMS market.
Randall Sherman
TECH TALK
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Screen Printing
Practical printer/dispensers.
Clive Ashmore -
Selective Soldering
Avoing cross-contamination.
Ursula Marquez de Tino, Ph.D. -
Wave Soldering Troubleshooting
Wave's sizzle is no tasty sound.
Paul Lotosky -
The Defects Database
Don't let microsectioning destroy the hole.
Dr. Davide Di Maio, Ph.D. -
Test and Inspection
OEMs still drive test technology.
Jun Balangue -
Process Doctor
Reacting to 'reactivity.'
Harald Wack, Ph.D. -
Getting Lean
'Testing' Lean strategies.
Chris Munroe
DEPARTMENTS
Off the Shelf
